Paradigm shifting in electronical components
LTCC is a ceramic multi-layers board manufacturing technic using
co-fired dielectric ceramic below 900℃ through 3D stacking with Ag, Pt electrodes.
LTCC (Low Temperature Co-firing Ceramic) can be defined as a cutting-edge
mechanism by which layers of silver or copper metal is printed onto ceramic
substrates to form passive components and the layers are then fired to form a very
durable end product.
The key advantage of this technology is that by being able to use multiple layers,
many different passive components can be fitted into a very small area and then
compounded to form a single device.
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